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Title: Thermal reactive ion etching technique involving use of self-heated cathode

In this work, the thermal reactive ion etching (TRIE) technique for etching hard-to-etch materials is presented. The TRIE technique employs a self-heated cathode and a thermally insulated aluminum plate is placed on the cathode of a regular reactive ion etching (RIE) system. By optimizing the beam size to support the sample stage, the temperature of the stage can be increased to a desired temperature without a cathode heater. The technique was used to etch a bulk titanium plate. An etch rate of 0.6 μm/min and an etch selectivity to nickel of 100 were achieved with SF{sub 6} plasma. The proposed technique makes a regular RIE system a more powerful etcher without the use of chlorine gas, a cathode heater, and an inductively coupled plasma source.
Authors:
; ; ;  [1]
  1. Graduate School of Science and Technology, Niigata University, Niigata 950-2181 (Japan)
Publication Date:
OSTI Identifier:
22392472
Resource Type:
Journal Article
Resource Relation:
Journal Name: Review of Scientific Instruments; Journal Volume: 86; Journal Issue: 4; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; ALUMINIUM; CATHODES; CHLORINE; ETCHING; HEATERS; IONS; MATERIALS; NICKEL; OPTIMIZATION; PLASMA; PLATES; SULFUR FLUORIDES; TITANIUM