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Title: Quantification of thermal and contact resistances of scanning thermal probes

Scanning thermal probes are widely used for imaging temperature fields with nanoscale resolution, for studying near-field radiative heat transport and for locally heating samples. In all these applications, it is critical to know the thermal resistance to heat flow within the probe and the thermal contact resistance between the probe and the sample. Here, we present an approach for quantifying the aforementioned thermal resistances using picowatt resolution heat flow calorimeters. The measured contact resistance is found to be in good agreement with classical predictions for thermal contact resistance. The techniques developed here are critical for quantitatively probing heat flows at the nanoscale.
Authors:
; ; ; ; ;  [1] ;  [1] ;  [2]
  1. Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109 (United States)
  2. (United States)
Publication Date:
OSTI Identifier:
22392032
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 105; Journal Issue: 20; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ELECTRIC CONDUCTIVITY; FORECASTING; HEAT TRANSFER; NANOSTRUCTURES