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Title: Stress intensity factors of eccentric cracks in bi-materials plate under mode I loading

Bi-material plates were generally used to joint electronic devices or mechanical components requiring dissimilar materials to be attached. During services, mechanical failure can be occurred due to the formation of cracks at the interfacial joint or away from the centre. Generally, linear elastic fracture mechanics approach is used to characterize these cracks based on stress intensity factors (SIF). Based on the literature survey, the SIFs for the central cracks were easily available. However, the SIFs for eccentric cracks were difficult to obtain. Therefore, this paper presented the SIFs for eccentric cracks subjected to mode I tension loading. Three important parameters were used such as relative crack depth, a/L, relative offset distance, b/L and elastic mismatch, E{sub 1}/E{sub 2} or α. It was found that such parameters significantly affected the characteristic of SIFs and it was depend on the location of cracks.
Authors:
 [1]
  1. Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor (Malaysia)
Publication Date:
OSTI Identifier:
22391664
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1660; Journal Issue: 1; Conference: ICoMEIA 2014: International Conference on Mathematics, Engineering and Industrial Applications 2014, Penang (Malaysia), 28-30 May 2014; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; BIMETALS; CRACKS; ELASTICITY; ELECTRONIC EQUIPMENT; FAILURES; FRACTURE MECHANICS; JOINTS; LOADING; PLATES; STRESS INTENSITY FACTORS