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Title: Fast and low-dose computed laminography using compressive sensing based technique

Computed laminography (CL) is well known for inspecting microstructures in the materials, weldments and soldering defects in high density packed components or multilayer printed circuit boards. The overload problem on x-ray tube and gross failure of the radio-sensitive electronics devices during a scan are among important issues in CL which needs to be addressed. The sparse-view CL can be one of the viable option to overcome such issues. In this work a numerical aluminum welding phantom was simulated to collect sparsely sampled projection data at only 40 views using a conventional CL scanning scheme i.e. oblique scan. A compressive-sensing inspired total-variation (TV) minimization algorithm was utilized to reconstruct the images. It is found that the images reconstructed using sparse view data are visually comparable with the images reconstructed using full scan data set i.e. at 360 views on regular interval. We have quantitatively confirmed that tiny structures such as copper and tungsten slags, and copper flakes in the reconstructed images from sparsely sampled data are comparable with the corresponding structure present in the fully sampled data case. A blurring effect can be seen near the edges of few pores at the bottom of the reconstructed images from sparsely sampled data,more » despite the overall image quality is reasonable for fast and low-dose NDT.« less
Authors:
; ;  [1]
  1. Department of Nuclear and Quantum Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701 (Korea, Republic of)
Publication Date:
OSTI Identifier:
22391258
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1650; Journal Issue: 1; Conference: 41. Annual Review of Progress in Quantitative Nondestructive Evaluation, Boise, ID (United States), 20-25 Jul 2014; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ALGORITHMS; ALUMINIUM; COMPARATIVE EVALUATIONS; COPPER; IMAGES; LAYERS; MICROSTRUCTURE; PHANTOMS; PRINTED CIRCUITS; RADIATION DOSES; SOLDERING; TOMOGRAPHY; TUNGSTEN; X-RAY TUBES