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Title: Molecular dynamics analysis of metal surface sputtering due to bombardment of high energy particles

Dependence of sputtering yield of Cu (100) and Ni (100) metal surface by bombardment of 200 Ar ions at various energies and angles of projections is investigated in this paper. The sputtering yield has been calculated by performing molecular dynamics simulation and the same is compared with experiments and theoretical predictions wherever possible. Additionally the kinetic energy, velocity and scattering angle distribution for sputtered and incident atoms are also observed. The results obtained from the present molecular dynamics simulations are found to be in good agreement with experimental data and theoretical estimates. It is observed that the sputtering yield increases as the energy of the bombarding ion increases. Furthermore as the incidence angle increases, the sputtering yield increases until a specific angle and then decreases as normal incidence is approached.
Authors:
; ;  [1]
  1. Department of Aerospace Engineering, Indian Institute of Technology Kanpur (India)
Publication Date:
OSTI Identifier:
22390591
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1628; Journal Issue: 1; Conference: 29. International Symposium on Rarefied Gas Dynamics, Xi'an (China), 13-18 Jul 2014; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ARGON IONS; ATOMS; COMPARATIVE EVALUATIONS; COMPUTERIZED SIMULATION; COPPER; CRYSTAL STRUCTURE; INCIDENCE ANGLE; KINETIC ENERGY; MOLECULAR DYNAMICS METHOD; NICKEL; SCATTERING; SPUTTERING; SURFACES; VELOCITY; YIELDS