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Title: Ni doping on Cu surfaces: Reduced copper resistivity

The resistivity of 9.3-nm-thick epitaxial and polycrystalline Cu is reduced by 11%–13% when coated with 0.75 nm Ni. Sequential in situ and ex situ transport measurements show that this is due to electron surface scattering which exhibits a specularity p = 0.7 for the Cu-vacuum interface that transitions to completely diffuse (p = 0) when exposed to air. In contrast, Ni-coated surfaces exhibit partial specularity with p = 0.3 in vacuum and p = 0.15 in air, as Cu{sub 2}O formation is suppressed, leading to a smaller surface potential perturbation and a lower density of localized surface states, yielding less diffuse electron scattering.
Authors:
; ;  [1]
  1. Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)
Publication Date:
OSTI Identifier:
22350785
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 105; Journal Issue: 13; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; COPPER; COPPER OXIDES; DENSITY; DISTURBANCES; ELECTRIC CONDUCTIVITY; ELECTRONS; EPITAXY; INTERFACES; NICKEL ADDITIONS; PERTURBATION THEORY; POLYCRYSTALS; SCATTERING; SURFACE POTENTIAL; SURFACES