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Title: Grain boundary and triple junction diffusion in nanocrystalline copper

Grain boundary and triple junction diffusion in nanocrystalline Cu samples with grain sizes, 〈d〉, of ∼35 and ∼44 nm produced by spark plasma sintering were investigated by the radiotracer method using the {sup 63}Ni isotope. The measured diffusivities, D{sub eff}, are comparable with those determined previously for Ni grain boundary diffusion in well-annealed, high purity, coarse grained, polycrystalline copper, substantiating the absence of a grain size effect on the kinetic properties of grain boundaries in a nanocrystalline material at grain sizes d ≥ 35 nm. Simultaneously, the analysis predicts that if triple junction diffusion of Ni in Cu is enhanced with respect to the corresponding grain boundary diffusion rate, it is still less than 500⋅D{sub gb} within the temperature interval from 420 K to 470 K.
Authors:
; ; ;  [1] ;  [2] ;  [1] ;  [3]
  1. Institut für Materialphysik, Universität Münster, Wilhelm-Klemm-Straße 10, D-48149, Münster (Germany)
  2. College of Materials Science and Engineering, Beijing University of Technology, 100124 Beijing (China)
  3. (China)
Publication Date:
OSTI Identifier:
22314381
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 116; Journal Issue: 9; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ANNEALING; COMPARATIVE EVALUATIONS; COPPER; DIFFUSION; GRAIN BOUNDARIES; GRAIN SIZE; IMPURITIES; NANOSTRUCTURES; NICKEL 63; PLASMA; POLYCRYSTALS; SINTERING; TRACER TECHNIQUES