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Title: Study of heat sources interacting in integrated circuits by laser mirage effect

This work exploits the mirage effect to analyze multiple heat sources thermally interacting in an integrated circuit (IC) by means of a probe IR laser beam, which strikes on the die lateral walls and passes through the die substrate. Under such conditions, the criteria for locating such hot spots, as well as their relative power dissipation, are discussed on the basis of a theoretical model inferred in this work. Finally, the technique feasibility is shown in a real application scenario, obtaining 5-μm spatial lateral resolution and an error in power dissipation measurements below 5%. This method may become a practical alternative to usual off-chip techniques for inspecting hot spots in ICs and to experimentally characterize heat flow in the semiconductor substrate.
Authors:
; ;  [1] ;  [2]
  1. Centre Nacional de Microelectrònica IMB-CNM (CSIC), Campus UAB, 08193 Bellaterra (Barcelona) (Spain)
  2. Departament d'Enginyeria Electrònica, Universitat Politècnica de Catalunya, Barcelona 08034 (Spain)
Publication Date:
OSTI Identifier:
22310999
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 105; Journal Issue: 8; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; BEAMS; DIES; HEAT FLUX; HEAT SOURCES; HOT SPOTS; INFRARED RADIATION; INTEGRATED CIRCUITS; LASER RADIATION; RESOLUTION; SEMICONDUCTOR MATERIALS; SUBSTRATES