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Title: Facile electron-beam lithography technique for irregular and fragile substrates

A facile technique is presented which enables high-resolution electron beam lithography on irregularly-shaped, non-planar or fragile substrates such as the edges of a silicon chip, thin and narrow suspended beams and bridges, or small cylindrical wires. The method involves a spin-free dry-transfer of pre-formed uniform-thickness polymethyl methacrylate, followed by conventional electron beam writing, metal deposition, and lift-off. High-resolution patterning is demonstrated for challenging target substrates. The technique should find broad application in micro- and nano-technology research arenas.
Authors:
; ;  [1] ;  [2] ;  [2]
  1. Department of Physics, University of California at Berkeley, Berkeley, California 94720 (United States)
  2. (United States)
Publication Date:
OSTI Identifier:
22310674
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 105; Journal Issue: 17; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; CYLINDRICAL CONFIGURATION; DEPOSITION; ELECTRON BEAMS; FORECASTING; METALS; MICROSTRUCTURE; NANOSTRUCTURES; RESOLUTION; SILICON; SPIN; SUBSTRATES; THICKNESS