Facile electron-beam lithography technique for irregular and fragile substrates

Journal Article · Mon Oct 27 00:00:00 EDT 2014 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.4900505· OSTI ID:22310674

Chang, Jiyoung; Zhou, Qin; Zettl, Alex ^[1]

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1. Department of Physics, University of California at Berkeley, Berkeley, California 94720 (United States)

A facile technique is presented which enables high-resolution electron beam lithography on irregularly-shaped, non-planar or fragile substrates such as the edges of a silicon chip, thin and narrow suspended beams and bridges, or small cylindrical wires. The method involves a spin-free dry-transfer of pre-formed uniform-thickness polymethyl methacrylate, followed by conventional electron beam writing, metal deposition, and lift-off. High-resolution patterning is demonstrated for challenging target substrates. The technique should find broad application in micro- and nano-technology research arenas.

• OSTI ID: 22310674
• Journal Information: Applied Physics Letters, Vol. 105, Issue 17; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
CYLINDRICAL CONFIGURATION
DEPOSITION
ELECTRON BEAMS
FORECASTING
METALS
MICROSTRUCTURE
NANOSTRUCTURES
RESOLUTION
SILICON
SPIN
SUBSTRATES
THICKNESS