Solid-state dewetting of Au/Ni bilayers: The effect of alloying on morphology evolution
- Institute of Materials Engineering and Institute of Micro- and Nanotechnologies MacroNano, Chair Materials for Electronics and Electrical Engineering, TU Ilmenau, Ilmenau 98693 (Germany)
The solid-state dewetting of thin Au/Ni bilayers deposited onto SiO{sub 2}/Si substrates is investigated. A rapid thermal treatment is used to induce the dewetting process by an increase in temperature. The evolution of the (111) peaks of X-ray diffraction reveals a characteristic change due to mixing of Au and Ni. At low temperature, the Au-Ni thin film is found to break up at the phase boundaries and growing voids are shown to be surrounded by a Ni-rich phase. Branch-like void growth is observed. Upon annealing at increasing temperatures, Au-Ni solid solutions are formed well above the bulk equilibrium solubility of Au and Ni. It is found that this metastable phase formation makes the Au-Ni thin film less vulnerable to rupturing. Moreover, growth mode of still evolving voids changes into a more regular, faceted one due to alloying. Finally, it is shown that annealing above the miscibility gap forms supersaturated, well-oriented Au-Ni solid solution agglomerates via dewetting.
- OSTI ID:
- 22308555
- Journal Information:
- Journal of Applied Physics, Vol. 116, Issue 4; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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