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Title: Dependence of electric strength on the ambient temperature

At present, the volume concentration of electronic components in their miniaturization to different types of microchips and increasing their performance raises the problem of cooling such elements due to the increasing density of heat flow of heat loss. Compliance with safe operating temperature of active semiconductor element is very closely related to the reliability and durability not only components, but also the entire device. Often it is also necessary to electrically isolate the unit from the side of the cooler air. Cooling demand by natural convection is typical for applications with high operating reliability. To the reliability of the system for removing heat loss increased, it is necessary to minimize need to use the mechanically or electrically powered elements, such as circulation pumps or fans. Experience to date with applications of heat pipe in specific systems appears to be the most appropriate method of cooling.
Authors:
; ;  [1]
  1. University of Žilina, Faculty of Mechanical Engineering, Department of Power Engeneering, Univerzitná 1, 010 26 Žilina (Slovakia)
Publication Date:
OSTI Identifier:
22308415
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1608; Journal Issue: 1; Conference: 19. international conference on the application of experimental and numerical methods in fluid mechanics and energetics 2014, Liptovsky Jan (Slovakia), 9-11 Apr 2014; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; AIR; AMBIENT TEMPERATURE; CONCENTRATION RATIO; COOLING; HEAT EXCHANGERS; HEAT FLUX; HEAT LOSSES; NATURAL CONVECTION; PUMPS; SEMICONDUCTOR MATERIALS