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Title: Investigating the plasma parameters of an Ar/O{sub 2} discharge during the sputtering of Al targets in an inverted cylindrical magnetron

The plasma parameters and reaction kinetics in an inverted cylindrical magnetron chamber have been studied with an energy resolved mass spectrometer during the sputtering of aluminum targets in an Ar/O{sub 2} discharge. Mixtures of argon and oxygen were studied as a function of oxygen percentage (0%–90%) in the discharge. The plasma was powered at 4 kW and 40 kHz at a process pressure of 5 mTorr. Al{sup +}, Al, AlO, AlO{sup +}, O{sub 2}{sup +}, O{sup +}, Al{sub 2}O{sup +}, and Ar{sup +} were among the species detected in the discharge. The deposition rate of the deposited thin film decreased with increasing oxygen percentage in the discharge and results indicated that the pure gamma-alumina was obtained when the percentage of oxygen was approximately 70%. The linear plot of energy distributions of the positively charged film forming species changed from a single peak to a bimodal distribution as the percentage of oxygen exceeds 65%. In a log plot, however, the distributions showed multiple peaks ranging from 2 eV to 78 eV. Fluctuations of about 1 eV in peak energies were observed.
Authors:
 [1] ;  [2] ;  [3]
  1. University of Memphis, Memphis, Tennessee 38152 (United States)
  2. University of Denver, Denver, Colorado 80208 (United States)
  3. University of Arkansas, Fayetteville, Arkansas 72701 (United States)
Publication Date:
OSTI Identifier:
22303446
Resource Type:
Journal Article
Resource Relation:
Journal Name: Physics of Plasmas; Journal Volume: 21; Journal Issue: 9; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 70 PLASMA PHYSICS AND FUSION TECHNOLOGY; ALUMINIUM IONS; ALUMINIUM OXIDES; APPROXIMATIONS; ARGON IONS; CYLINDRICAL CONFIGURATION; ENERGY SPECTRA; EV RANGE; MAGNETRONS; MASS SPECTROMETERS; OXYGEN; PLASMA; REACTION KINETICS; THIN FILMS