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Title: Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects

The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing. - Highlights: • Thermomechanical response shows a close relationship with the grain structure. • Deformation was frequently confined within the high-angle grain boundaries. • Different grain orientations exhibit different hardness. • Deformation twins can be induced around the indents in SAC105 solder interconnects.
Authors:
 [1] ;  [2] ; ;  [3] ;  [1] ;  [4]
  1. Shenzhen Key Laboratory of Advanced Materials, Department of Materials Science and Engineering, Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen, 518055 (China)
  2. College of Mechanical Engineering, Jiamusi University, Jiamusi, 154007 (China)
  3. Yik Shing Tat Industrial Co., Ltd., Shenzhen, 518101 (China)
  4. (China)
Publication Date:
OSTI Identifier:
22288678
Resource Type:
Journal Article
Resource Relation:
Journal Name: Materials Characterization; Journal Volume: 85; Other Information: Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; CRACKING; DEFORMATION; DIFFRACTION; ELECTRONS; GRAIN BOUNDARIES; GRAIN ORIENTATION; HARDNESS; THERMAL SHOCK; VICKERS HARDNESS