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Title: Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

This letter reports the use of the Laser-Induced Forward Transfer (LIFT) technique for the fabrication of indium micro-bumps for the flip-chip (FC) bonding of single vertical-cavity surface-emitting laser chips. The FC bonded chips were electrically and optically characterized, and the successful functioning of the devices post-bonding is demonstrated. The die shear and life-time tests carried out on the bonded chips confirmed the mechanical reliability of the LIFT-assisted FC bonded assemblies.
Authors:
; ;  [1]
  1. Centre for Microsystems Technology, imec/Ghent University, Technologiepark 914A, B-9052 Gent (Belgium)
Publication Date:
OSTI Identifier:
22283184
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 104; Journal Issue: 6; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; BONDING; INDIUM; LASER CAVITIES; LASER RADIATION; LASERS; RELIABILITY; SHEAR PROPERTIES; SURFACES