Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
- Centre for Microsystems Technology, imec/Ghent University, Technologiepark 914A, B-9052 Gent (Belgium)
This letter reports the use of the Laser-Induced Forward Transfer (LIFT) technique for the fabrication of indium micro-bumps for the flip-chip (FC) bonding of single vertical-cavity surface-emitting laser chips. The FC bonded chips were electrically and optically characterized, and the successful functioning of the devices post-bonding is demonstrated. The die shear and life-time tests carried out on the bonded chips confirmed the mechanical reliability of the LIFT-assisted FC bonded assemblies.
- OSTI ID:
- 22283184
- Journal Information:
- Applied Physics Letters, Vol. 104, Issue 6; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
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