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Title: Hybrid stretchable circuits on silicone substrate

Abstract

When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

Authors:
;  [1]
  1. School of Engineering and Applied Sciences and Kavli Institute for Bionano Science and Technology, Harvard University, Cambridge, Massachusetts 02138 (United States)
Publication Date:
OSTI Identifier:
22273606
Resource Type:
Journal Article
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Volume: 115; Journal Issue: 14; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0021-8979
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COMPOSITE MATERIALS; ELASTICITY; INTERFACES; MATRIX MATERIALS; PRINTED CIRCUITS; SILICONES; STRAINS; SUBSTRATES

Citation Formats

Robinson, A., E-mail: adam.1.robinson@nokia.com, Aziz, A., E-mail: a.aziz1@lancaster.ac.uk, Liu, Q., Suo, Z., and Lacour, S. P., E-mail: stephanie.lacour@epfl.ch. Hybrid stretchable circuits on silicone substrate. United States: N. p., 2014. Web. doi:10.1063/1.4871279.
Robinson, A., E-mail: adam.1.robinson@nokia.com, Aziz, A., E-mail: a.aziz1@lancaster.ac.uk, Liu, Q., Suo, Z., & Lacour, S. P., E-mail: stephanie.lacour@epfl.ch. Hybrid stretchable circuits on silicone substrate. United States. https://doi.org/10.1063/1.4871279
Robinson, A., E-mail: adam.1.robinson@nokia.com, Aziz, A., E-mail: a.aziz1@lancaster.ac.uk, Liu, Q., Suo, Z., and Lacour, S. P., E-mail: stephanie.lacour@epfl.ch. 2014. "Hybrid stretchable circuits on silicone substrate". United States. https://doi.org/10.1063/1.4871279.
@article{osti_22273606,
title = {Hybrid stretchable circuits on silicone substrate},
author = {Robinson, A., E-mail: adam.1.robinson@nokia.com and Aziz, A., E-mail: a.aziz1@lancaster.ac.uk and Liu, Q. and Suo, Z. and Lacour, S. P., E-mail: stephanie.lacour@epfl.ch},
abstractNote = {When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.},
doi = {10.1063/1.4871279},
url = {https://www.osti.gov/biblio/22273606}, journal = {Journal of Applied Physics},
issn = {0021-8979},
number = 14,
volume = 115,
place = {United States},
year = {Mon Apr 14 00:00:00 EDT 2014},
month = {Mon Apr 14 00:00:00 EDT 2014}
}