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Title: Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces

We report Time-Domain ThermoReflectance experiments measuring the Thermal Boundary Conductance (TBC) of interfaces between diamond and metal surfaces, based on samples consisting of [111]-oriented diamond substrates with hydrogen or with sp{sup 2} carbon surface terminations created using plasma treatments. In a concurrent theoretical study, we calculate the work of adhesion between Ni, Cu, and diamond interfaces with (111) surface orientation, with or without hydrogen termination of the diamond surface, using first-principles electronic structure calculations based on density functional theory (DFT). We find a positive correlation between the calculated work of adhesion and the measured conductance of these interfaces, suggesting that DFT could be used as a screening tool to identify metal/dielectric systems with high TBC. We also explain the negative effect of hydrogen on the thermal conductance of metal/diamond interfaces.
Authors:
;  [1] ;  [2] ;  [3]
  1. Laboratoire de Métallurgie Mécanique, Ecole Polytechnique Fédérale de Lausanne, Lausanne (Switzerland)
  2. School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138 (United States)
  3. Department of Physics and School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138 (United States)
Publication Date:
OSTI Identifier:
22271149
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 115; Journal Issue: 12; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ADHESION; COPPER; CORRELATIONS; CRYSTAL STRUCTURE; DENSITY FUNCTIONAL METHOD; DIAMONDS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRONIC STRUCTURE; HYDROGEN; INTERFACES; NICKEL; SUBSTRATES; SURFACES