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Title: Selective light sintering of Aerosol-Jet printed silver nanoparticle inks on polymer substrates

Abstract

Printing silver nanoparticle inks to generate conductive structures for electronics on polymer substrates has gained increasing relevance in recent years. In this context, the Aerosol-Jet Technology is well suited to print silver ink on 3D-Molded Interconnect Devices (MID). The deposited ink requires thermal post-treatment to obtain sufficient electrical conductivity and adhesion. However, commonly used oven sintering cannot be applied for many thermoplastic substrates due to low melting temperatures. In this study a new sintering technology, selective light sintering, is presented, based on the focused, continuous light beam of a xenon lamp. Sintering experiments were conducted with Aerosol-Jet printed structures on various polycarbonate (PC) substrates. Especially on neat, light transparent PC, silver tracks were evenly sintered with marginal impact to the substrate. Electrical conductivities significantly exceed the values obtained with conventional oven sintering. Adhesive strength is sufficient for conductive tracks. Experiments with non-transparent PC substrates led to substrate damage due to increased light absorption. Therefore a concept for a variation of light sintering was developed, using optical filters. First experiments showed significant reduction of substrate damage and good sintering qualities. The highly promising results of the conducted experiments provide a base for further investigations to increase adhesion and qualifying the technologymore » for MID applications and a broad spectrum of thermoplastic substrates.« less

Authors:
; ;  [1]
  1. Institute for Factory Automation and Production Systems, University of Erlangen-Nuremberg (Germany)
Publication Date:
OSTI Identifier:
22271000
Resource Type:
Journal Article
Journal Name:
AIP Conference Proceedings
Additional Journal Information:
Journal Volume: 1593; Journal Issue: 1; Conference: PPS-29: 29. international conference of the Polymer Processing Society, Nuremberg (Germany), 15-19 Jul 2013; Other Information: (c) 2014 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0094-243X
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY; ADHESION; AEROSOLS; DAMAGE; ELECTRIC CONDUCTIVITY; MELTING POINTS; NANOSTRUCTURES; OPTICAL FILTERS; PARTICLE SIZE; PARTICLES; POLYCARBONATES; SILVER; SINTERING; SUBSTRATES; THERMOPLASTICS; VISIBLE RADIATION

Citation Formats

Schuetz, K., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de, Hoerber, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de, and Franke, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de. Selective light sintering of Aerosol-Jet printed silver nanoparticle inks on polymer substrates. United States: N. p., 2014. Web. doi:10.1063/1.4873881.
Schuetz, K., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de, Hoerber, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de, & Franke, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de. Selective light sintering of Aerosol-Jet printed silver nanoparticle inks on polymer substrates. United States. https://doi.org/10.1063/1.4873881
Schuetz, K., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de, Hoerber, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de, and Franke, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de. 2014. "Selective light sintering of Aerosol-Jet printed silver nanoparticle inks on polymer substrates". United States. https://doi.org/10.1063/1.4873881.
@article{osti_22271000,
title = {Selective light sintering of Aerosol-Jet printed silver nanoparticle inks on polymer substrates},
author = {Schuetz, K., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de and Hoerber, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de and Franke, J., E-mail: klaus.schuetz1@gmx.de, E-mail: hoerber@faps.uni-erlangen.de, E-mail: franke@faps.uni-erlangen.de},
abstractNote = {Printing silver nanoparticle inks to generate conductive structures for electronics on polymer substrates has gained increasing relevance in recent years. In this context, the Aerosol-Jet Technology is well suited to print silver ink on 3D-Molded Interconnect Devices (MID). The deposited ink requires thermal post-treatment to obtain sufficient electrical conductivity and adhesion. However, commonly used oven sintering cannot be applied for many thermoplastic substrates due to low melting temperatures. In this study a new sintering technology, selective light sintering, is presented, based on the focused, continuous light beam of a xenon lamp. Sintering experiments were conducted with Aerosol-Jet printed structures on various polycarbonate (PC) substrates. Especially on neat, light transparent PC, silver tracks were evenly sintered with marginal impact to the substrate. Electrical conductivities significantly exceed the values obtained with conventional oven sintering. Adhesive strength is sufficient for conductive tracks. Experiments with non-transparent PC substrates led to substrate damage due to increased light absorption. Therefore a concept for a variation of light sintering was developed, using optical filters. First experiments showed significant reduction of substrate damage and good sintering qualities. The highly promising results of the conducted experiments provide a base for further investigations to increase adhesion and qualifying the technology for MID applications and a broad spectrum of thermoplastic substrates.},
doi = {10.1063/1.4873881},
url = {https://www.osti.gov/biblio/22271000}, journal = {AIP Conference Proceedings},
issn = {0094-243X},
number = 1,
volume = 1593,
place = {United States},
year = {Thu May 15 00:00:00 EDT 2014},
month = {Thu May 15 00:00:00 EDT 2014}
}