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Title: Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.
Authors:
; ; ;  [1]
  1. Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)
Publication Date:
OSTI Identifier:
22270994
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1593; Journal Issue: 1; Conference: PPS-29: 29. international conference of the Polymer Processing Society, Nuremberg (Germany), 15-19 Jul 2013; Other Information: (c) 2014 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COMPOSITE MATERIALS; DENSITY; EPOXIDES; FILLERS; GLASS; MATRIX MATERIALS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUITS; RESINS; SUBSTRATES; THERMAL EXPANSION; TRANSITION TEMPERATURE