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Title: Patterned electrochemical deposition of copper using an electron beam

We describe a technique for patterning clusters of metal using electrochemical deposition. By operating an electrochemical cell in the transmission electron microscope, we deposit Cu on Au under potentiostatic conditions. For acidified copper sulphate electrolytes, nucleation occurs uniformly over the electrode. However, when chloride ions are added there is a range of applied potentials over which nucleation occurs only in areas irradiated by the electron beam. By scanning the beam we control nucleation to form patterns of deposited copper. We discuss the mechanism for this effect in terms of electron beam-induced reactions with copper chloride, and consider possible applications.
Authors:
 [1] ; ; ;  [2] ;  [3]
  1. Kamerlingh Onnes Laboratory, Leiden University, P.O. Box 9504, 2300 RA Leiden (Netherlands)
  2. IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, New York 10598 (United States)
  3. IMEC, Kapeldreef 75, B-3001 Leuven (Belgium)
Publication Date:
OSTI Identifier:
22269562
Resource Type:
Journal Article
Resource Relation:
Journal Name: APL Materials; Journal Volume: 2; Journal Issue: 2; Other Information: (c) 2014 Author(s); Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; CHLORINE IONS; CONTROL; COPPER; COPPER CHLORIDES; DEPOSITS; ELECTROCHEMICAL CELLS; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; ELECTRON BEAMS; IRRADIATION; NUCLEATION; SULFATES; TRANSMISSION ELECTRON MICROSCOPY