Crystallographically tilted and partially strain relaxed GaN grown on inclined (111) facets etched on Si(100) substrate
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117576 (Singapore)
- Singapore Institute of Technology, 10 Dover Drive, Singapore 138683 (Singapore)
- Singapore-MIT Alliance, National University of Singapore, Singapore 117576 (Singapore)
- Institute of Materials Research and Engineering, 3 Research Link, 117602 Singapore (Singapore)
- Singapore Synchrotron Light Source, National University of Singapore, 5 Research Link, 117603 Singapore (Singapore)
- School of Physical and Mathematical Sciences, Nanyang Technological University, SPMS-03-01, 21 Nanyang Link (Singapore)
High resolution X-ray diffractometry (HR-XRD), Photoluminescence, Raman spectroscopy, and Transmission electron microscope measurements are reported for GaN deposited on a conventional Si(111) substrate and on the (111) facets etched on a Si(100) substrate. HR-XRD reciprocal space mappings showed that the GaN(0002) plane is tilted by about 0.63° ± 0.02° away from the exposed Si(111) growth surface for GaN deposited on the patterned Si(100) substrate, while no observable tilt existed between the GaN(0002) and Si(111) planes for GaN deposited on the conventional Si(111) substrate. The ratio of integrated intensities of the yellow to near band edge (NBE) luminescence (I{sub YL}/I{sub NBE}) was determined to be about one order of magnitude lower in the case of GaN deposited on the patterned Si(100) substrate compared with GaN deposited on the conventional Si(111) substrate. The Raman E{sub 2}(high) optical phonon mode at 565.224 ± 0.001 cm{sup −1} with a narrow full width at half maximum of 1.526 ± 0.002 cm{sup −1} was measured, for GaN deposited on the patterned Si(100) indicating high material quality. GaN deposition within the trench etched on the Si(100) substrate occurred via diffusion and mass-transport limited mechanism. This resulted in a differential GaN layer thickness from the top (i.e., 1.8 μm) of the trench to the bottom (i.e., 0.3 μm) of the trench. Mixed-type dislocation constituted about 80% of the total dislocations in the GaN grown on the inclined Si(111) surface etched on Si(100)
- OSTI ID:
- 22267779
- Journal Information:
- Journal of Applied Physics, Vol. 114, Issue 24; Other Information: (c) 2013 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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