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Title: Looking for footprint of bulk metallic glass in electronic and phonon heat capacities of Cu{sub 55}Hf{sub 45−x}Ti{sub x} alloys

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4875043· OSTI ID:22267704
 [1];  [2]; ;  [3];  [4];  [5];  [6]
  1. Institut Néel, Université Grenoble Alpes, F-38042 Grenoble (France)
  2. CNRS, Institut Néel, F-38042 Grenoble (France)
  3. Department of Physics, Trg Lj. Gaja 6, HR-31000 Osijek (Croatia)
  4. Department of Physics, Faculty of Science, Bijenička c. 32, HR-10000 Zagreb (Croatia)
  5. Institute for Materials Research-UNAM, Ciudad Universitaria Coyoacan, C.P. 04510 Mexico D.F. (Mexico)
  6. Department of Engineering Materials, University of Sheffield, Sheffield S1 3JD (United Kingdom)

We report on the heat capacity investigation of Cu{sub 55}Hf{sub 45−x}Ti{sub x} metallic glasses. The most appropriate procedure to estimate low temperature electronic and phonon contributions has been determined. Both contributions exhibit monotonous Ti concentration dependence, demonstrating that there is no relation of either the electron density of states at the Fermi level or the Debye temperature to the increased glass forming ability in the Ti concentration range x = 15–30. The thermodynamic parameters (e.g., reduced glass temperature) remain better indicators in assessing the best composition for bulk metallic glass formation.

OSTI ID:
22267704
Journal Information:
Applied Physics Letters, Vol. 104, Issue 17; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English