Effect of argon gas flow rate on properties of film electrodes prepared by thermal vacuum evaporation from synthesized Cu{sub 2}SnSe{sub 3} source
Journal Article
·
· AIP Conference Proceedings
- Department of Physics, Faculty of Science, Universiti Putra Malaysia, 43400 UPM Serdang (Malaysia)
- Department of Chemistry, Faculty of Science, Universiti Putra Malaysia, 43400 UPM Serdang (Malaysia)
- SSERL, Department of Chemistry An-Najah N. University, PO Box 7, Nablus, West Bank (Country Unknown)
- Department of Molecular Science, School of Medicine, Shimane University, Izumo, Shimane, 693-8501 (Japan)
This work describes a new technique to enhance photoresponse of metal chalcogenide-based semiconductor film electrodes deposited by thermal vacuum evaporation under argon gas flow from synthesized Cu{sub 2}SnSe{sub 3} sources. SnSe formation with Cu-doped was obtained under higher argon gas flow rate (V{sub A} = 25 cm{sup 3}/min). Higher value of photoresponse was observed for films deposited under V{sub A} = 25 cm{sup 3}/min which was 9.1%. This finding indicates that Cu atoms inside the SnSe film were important to increase carrier concentrations that promote higher photoresponse.
- OSTI ID:
- 22266180
- Journal Information:
- AIP Conference Proceedings, Vol. 1588, Issue 1; Conference: 4. international meeting on frontiers in physics, Kuala Lumpur (Malaysia), 27-30 Aug 2013; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
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