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Title: Electrical properties of dislocations in III-Nitrides

Research on GaN, AlN, InN (III-N) and their alloys is achieving new heights due their high potential applications in photonics and electronics. III-N semiconductors are mostly grown epitaxially on sapphire, and due to the large lattice mismatch and the differences in the thermal expansion coefficients, the structures usually contain many threading dislocations (TDs). While their structural properties have been widely investigated, their electrical characteristics and their role in the transport properties of the devices are still debated. In the present contribution we will show conductive AFM studies of TDs in GaN and Al/In GaN ternary alloys to evidence the role of strain, different surface polarity and composition on their electrical properties. Local I-V curves measured at TDs allowed us to clarify their role in the macroscopic electrical properties (leakage current, mobilities) of III-N based devices. Samples obtained by different growers (AIXTRON, III-V Lab) were studied. The comparison between the results obtained in the different alloys allowed us to understand the role of In and Al on the TDs electrical properties.
Authors:
; ; ;  [1]
  1. Physics and Astronomy Dept. University of Bologna, Italy viale C Berti Pichat 6/II, Bologna (Italy)
Publication Date:
OSTI Identifier:
22263705
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1583; Journal Issue: 1; Conference: ICDS-2013: 27. international conference on defects in semiconductors, Bologna (Italy), 21-26 Jul 2013; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ALLOYS; ALUMINIUM NITRIDES; ATOMIC FORCE MICROSCOPY; COMPARATIVE EVALUATIONS; DIAGRAMS; DISLOCATIONS; ELECTRICAL PROPERTIES; EPITAXY; GALLIUM NITRIDES; INDIUM NITRIDES; LEAKAGE CURRENT; SAPPHIRE; SEMICONDUCTOR MATERIALS; TERNARY ALLOY SYSTEMS; THERMAL EXPANSION