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Title: Hot deformation induced defects and performance enhancement in FeSb{sub 2} thermoelectric materials

The effect of hot deformation induced defects and texture on thermoelectric properties of FeSb{sub 2} bulk crystals has been investigated. The transport properties of the samples along both parallel and perpendicular direction of pressing were measured from 3 K to 300 K. The results showed that thermal conductivity of the deformed samples was significantly reduced. After twice deformation, the thermal conductivity of the sample along the perpendicular direction of pressing was decreased to 4 W/mK, which was only one third of that before deformation. Transmission electron microscopy observation revealed the presence of high density of lattice defects in the deformed samples. The lattice thermal conductivity was analyzed using the Debye-Callaway approximation, and the results showed that the deformation induced lattice imperfections play an important role in enhancing phonon scattering. In addition, both the electrical resistivity and Seebeck coefficient exhibited a weak anisotropy in the deformed samples. The figure of merit ZT of the bulk FeSb{sub 2} was significantly improved from 0.010 to 0.021 after deformation.
Authors:
; ; ; ; ;  [1] ;  [2] ;  [3]
  1. State Key Laboratory of Silicon Materials, Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027 (China)
  2. Center of Electron Microscopy, Zhejiang University, Hangzhou 310027 (China)
  3. Institute of Materials Physics, Hangzhou Dianzi University, Hangzhou 310018 (China)
Publication Date:
OSTI Identifier:
22257779
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 114; Journal Issue: 18; Other Information: (c) 2013 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ANISOTROPY; CRYSTAL DEFECTS; CRYSTALS; DEFECTS; DEFORMATION; ELECTRIC CONDUCTIVITY; PERFORMANCE; PHONONS; PRESSING; SCATTERING; THERMAL CONDUCTIVITY; THERMOELECTRIC MATERIALS; THERMOELECTRIC PROPERTIES; TRANSMISSION ELECTRON MICROSCOPY