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Title: A reliable control system for measurement on film thickness in copper chemical mechanical planarization system

In recent years, a variety of film thickness measurement techniques for copper chemical mechanical planarization (CMP) are subsequently proposed. In this paper, the eddy-current technique is used. In the control system of the CMP tool developed in the State Key Laboratory of Tribology, there are in situ module and off-line module for measurement subsystem. The in situ module can get the thickness of copper film on wafer surface in real time, and accurately judge when the CMP process should stop. This is called end-point detection. The off-line module is used for multi-points measurement after CMP process, in order to know the thickness of remained copper film. The whole control system is structured with two levels, and the physical connection between the upper and the lower is achieved by the industrial Ethernet. The process flow includes calibration and measurement, and there are different algorithms for two modules. In the process of software development, C++ is chosen as the programming language, in combination with Qt OpenSource to design two modules’ GUI and OPC technology to implement the communication between the two levels. In addition, the drawing function is developed relying on Matlab, enriching the software functions of the off-line module. The resultmore » shows that the control system is running stably after repeated tests and practical operations for a long time.« less
Authors:
; ; ; ; ; ;  [1]
  1. State Key Laboratory of Tribology, Tsinghua University, Beijing 100084 (China)
Publication Date:
OSTI Identifier:
22220228
Resource Type:
Journal Article
Resource Relation:
Journal Name: Review of Scientific Instruments; Journal Volume: 84; Journal Issue: 12; Other Information: (c) 2013 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; 42 ENGINEERING; ALGORITHMS; CALIBRATION; COMPUTER CODES; CONTROL SYSTEMS; COPPER; EDDY CURRENTS; FILMS; LOCAL AREA NETWORKS; MECHANICAL POLISHING; PROGRAMMING LANGUAGES; THICKNESS