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Title: Simulation of electrical conduction in thin polycrystalline metallic films: Impact of microstructure

We examine the impact of microstructural features on the electrical conductivity of a thin metallic film using Monte Carlo simulation. In particular, we obtain the dependence of the conductivity (in the absence of surface scattering) on average grain size and electron scattering mechanisms, the latter parametrized by a transmission coefficient, for a model polycrystal generated by a Voronoi tessellation. We find that the conductivity can be described in limiting cases in terms of either a simplified hopping model or a trapping model. Finally, we compare our results with the Mayadas-Shatzkes model of grain-boundary scattering and with experimental resistivity measurements for polycrystalline copper thin films.
Authors:
 [1] ;  [2]
  1. Department of Materials Science and Engineering and Department of Physics, Lehigh University, Bethlehem, Pennsylvania 18015 (United States)
  2. Department of Applied Physics and Applied Mathematics, Columbia University, New York, New York 10027 (United States)
Publication Date:
OSTI Identifier:
22217954
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 114; Journal Issue: 13; Other Information: (c) 2013 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COMPUTERIZED SIMULATION; COPPER; ELECTRIC CONDUCTIVITY; ELECTRONS; GRAIN BOUNDARIES; GRAIN SIZE; MONTE CARLO METHOD; POLYCRYSTALS; SCATTERING; SURFACES; THIN FILMS; TRAPPING