Kinetics and thermodynamics associated with Bi adsorption transitions at Cu and Ni grain boundaries
Journal Article
·
· Journal of Applied Physics
- Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, Illinois 61801 (United States)
The grain boundary diffusivity of Au in Cu and Cu-Bi, and Cu in Ni and Ni-Bi are characterized by secondary ion mass spectroscopy depth profiling. Samples are equilibrated in a Bi containing atmosphere at temperatures above and below the onset of grain boundary adsorption transitions, sometimes called complexion transitions. A simple thermo-kinetic model is used to estimate the relative entropic contributions to the grain boundary energies. The results indicate that the entropy term plays a major role in promoting thermally and chemically induced grain boundary complexion transition.
- OSTI ID:
- 22162932
- Journal Information:
- Journal of Applied Physics, Vol. 113, Issue 19; Other Information: (c) 2013 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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