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Title: Carbon diffusion in alumina from carbon and Ti{sub 2}AlC thin films

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.3573490· OSTI ID:21560169
; ; ;  [1];  [2]
  1. School of Physics, University of Sydney, Sydney, NSW 2006 (Australia)
  2. Australian Nuclear Science and Technology Organisation, PMB 1, Menai, New South Wales 2234 (Australia)

Carbon diffusion is observed in single crystal {alpha}-Al{sub 2}O{sub 3} substrates from carbon and Ti{sub 2}AlC thin films synthesized via pulsed cathodic arc deposition. Diffusion was found to occur at substrate temperatures of 570 deg. C and above. The diffusion coefficient of carbon in {alpha}-Al{sub 2}O{sub 3} is estimated to be of the order 3x10{sup -13} cm{sup 2}/s for deposition temperatures in the 570-770{sup o}C range by examining elastic recoil detection analysis (ERDA) elemental depth profiles. It is suggested that an appropriate diffusion barrier may be useful when depositing carbon containing thin films on {alpha}-Al{sub 2}O{sub 3} substrates at high temperatures.

OSTI ID:
21560169
Journal Information:
Journal of Applied Physics, Vol. 109, Issue 8; Other Information: DOI: 10.1063/1.3573490; (c) 2011 American Institute of Physics; ISSN 0021-8979
Country of Publication:
United States
Language:
English