Printability Optimization For Fine Pitch Solder Bonding

Journal Article · Mon Jan 17 00:00:00 EST 2011 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.3552565· OSTI ID:21513170

Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon ^[1]

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1. Advanced Welding and Joining Technology Center, Korea Institute of Industrial Technology, Incheon, 406-840 (Korea, Republic of)

Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

• OSTI ID: 21513170
• Journal Information: AIP Conference Proceedings, Vol. 1315, Issue 1; Conference: AMPT2010: International conference on advances in materials and processing technologies, Paris (France), 24-27 Oct 2010; Other Information: DOI: 10.1063/1.3552565; (c) 2010 American Institute of Physics; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALLOYS
BONDING
DESIGN
METALS
OPTIMIZATION
PITCHES
POLYCHLORINATED BIPHENYLS
RESPIRATORS
SHEAR PROPERTIES
SOLDERING
SURFACES
THICKNESS
VELOCITY
AROMATICS
CHLORINATED AROMATIC HYDROCARBONS
DIMENSIONS
ELEMENTS
FABRICATION
HALOGENATED AROMATIC HYDROCARBONS
JOINING
MECHANICAL PROPERTIES
ORGANIC CHLORINE COMPOUNDS
ORGANIC COMPOUNDS
ORGANIC HALOGEN COMPOUNDS
OTHER ORGANIC COMPOUNDS
WELDING