Study on the Properties of Ionized Metal Plasma Methodology on Titanium
Journal Article
·
· AIP Conference Proceedings
- School of Physics, Universiti Sains Malaysia, 11800 Penang (Malaysia)
- Infineon Technologies (Kulim) Sdn Bhd, Lot 10 and 11, Jalan Hi-Tech 7, Industrial Zone Phase 2, Kulim Hi-Tech Park, 09000, Kulim, Kedah Darul Aman (Malaysia)
Ionized Metal Plasma (IMP) deposition was used in depositing metal interconnection of titanium metal film. Inductively coupled plasma (ICP) was attached to chamber wall where it creates an electromagnetic field, thus, ionizing the sputtered metal atoms from target. The film morphology was observed by scanning electron microscope (SEM). Acoustic measurement of titanium film thickness showed that there was a comparable result with film resistance measured by 4-point probe. Results show that higher plasma density would cause tensile properties on the film stress.
- OSTI ID:
- 21410549
- Journal Information:
- AIP Conference Proceedings, Vol. 1250, Issue 1; Conference: PERFIK2009: National physics conference 2009, Malacca (Malaysia), 7-9 Dec 2009; Other Information: DOI: 10.1063/1.3469705; (c) 2010 American Institute of Physics; ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
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