Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron-Based Technique for In Situ Characterization
Abstract
In situ synchrotron radiation diffraction and confocal light microscopy is used to study fragmentation and buckling of thin brittle Ta layers with thicknesses of 50 nm, 100 nm and 200 nm on polyimide substrates. Synchrotron-based stress measurements confirm that cracking leads to relaxation of tensile stress. Simultaneously, compressive stress arises in transverse direction, which finally leads to buckling. This behavior can be explained quantitatively by a two-dimensional shear lag model. It is well established that the properties of the coating-substrate interface determine the processes of coating fragmentation and delamination. A possible approach for influencing and controlling these processes is given by the incorporation of a ductile interlayer. It can be observed that the presence of Cu interlayers with thicknesses of 5 nm, 20 nm and 50 nm reduces the fracture strength of brittle Ta coatings on polyimide substrates, whereas the resistance to buckling is increased significantly.
- Authors:
-
- Laboratory for Nanometallurgy, Department of Materials, ETH Zurich, Wolfgang-Pauli-Str. 10, CH-8093 Zurich (Switzerland)
- Department of Polymer Engineering, Faculty of Engineering Science, University of Bayreuth, Universitaetsstrasse 30, D-95447 Bayreuth (Germany)
- Publication Date:
- OSTI Identifier:
- 21316800
- Resource Type:
- Journal Article
- Journal Name:
- AIP Conference Proceedings
- Additional Journal Information:
- Journal Volume: 1143; Journal Issue: 1; Conference: 10. international workshop on stress-induced phenomena in metallization, Austin, TX (United States), 5-7 Nov 2008; Other Information: DOI: 10.1063/1.3169250; (c) 2009 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; BRITTLENESS; BUCKLING; COATINGS; COPPER; CRACKING; FRACTURE PROPERTIES; FRACTURES; INTERFACES; LAYERS; SHEAR; STRESSES; SUBSTRATES; SYNCHROTRON RADIATION; SYNCHROTRONS; TANTALUM; THICKNESS; THIN FILMS; X-RAY DIFFRACTION
Citation Formats
Frank, Stephan, Olliges, Sven, Spolenak, Ralph, and Handge, Ulrich A. Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron-Based Technique for In Situ Characterization. United States: N. p., 2009.
Web. doi:10.1063/1.3169250.
Frank, Stephan, Olliges, Sven, Spolenak, Ralph, & Handge, Ulrich A. Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron-Based Technique for In Situ Characterization. United States. https://doi.org/10.1063/1.3169250
Frank, Stephan, Olliges, Sven, Spolenak, Ralph, and Handge, Ulrich A. 2009.
"Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron-Based Technique for In Situ Characterization". United States. https://doi.org/10.1063/1.3169250.
@article{osti_21316800,
title = {Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron-Based Technique for In Situ Characterization},
author = {Frank, Stephan and Olliges, Sven and Spolenak, Ralph and Handge, Ulrich A},
abstractNote = {In situ synchrotron radiation diffraction and confocal light microscopy is used to study fragmentation and buckling of thin brittle Ta layers with thicknesses of 50 nm, 100 nm and 200 nm on polyimide substrates. Synchrotron-based stress measurements confirm that cracking leads to relaxation of tensile stress. Simultaneously, compressive stress arises in transverse direction, which finally leads to buckling. This behavior can be explained quantitatively by a two-dimensional shear lag model. It is well established that the properties of the coating-substrate interface determine the processes of coating fragmentation and delamination. A possible approach for influencing and controlling these processes is given by the incorporation of a ductile interlayer. It can be observed that the presence of Cu interlayers with thicknesses of 5 nm, 20 nm and 50 nm reduces the fracture strength of brittle Ta coatings on polyimide substrates, whereas the resistance to buckling is increased significantly.},
doi = {10.1063/1.3169250},
url = {https://www.osti.gov/biblio/21316800},
journal = {AIP Conference Proceedings},
issn = {0094-243X},
number = 1,
volume = 1143,
place = {United States},
year = {Thu Jun 18 00:00:00 EDT 2009},
month = {Thu Jun 18 00:00:00 EDT 2009}
}