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Title: High current metal ion implantation to synthesize some conducting metal-silicides

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.59293· OSTI ID:21208063
;  [1]
  1. Department of Materials Science and Engineering, Tsinghua University, Beijing 100084 (China)

High current metal-ion implantation by a metal vapor vacuum arc ion source was conducted to synthesize some conducting metal-silicides. It was found that C54-TiSi{sub 2}, ZrSi{sub 2}, NiSi{sub 2}, CoSi{sub 2}, {beta}-FeSi{sub 2}, NbSi{sub 2} and TaSi{sub 2} layers on Si wafers with good electric properties could be obtained directly after implantation. In comparison, the formation of some other silicides like {alpha}-FeSi{sub 2}, NbSi{sub 2}, TaSi{sub 2}, tetragonal-WSi{sub 2} and tetragonal-MoSi{sub 2} required an additional post-annealing to improve their crystallinity and thus their electric properties. Interestingly, the NiSi{sub 2} layers of superior electric properties were obtained at a selected Ni-ion current density of 35 {mu}A/cm{sup 2}. At this current, a beam heating raised the Si wafer to a specific temperature of 380 deg. C, at which the size difference between NiSi{sub 2} and Si lattices was nil. The resistivity of the NiSi{sub 2} layers so obtained was much lower than that of the Ni-disilicide formed by solid-state reaction at >750 deg. C. The formation mechanism of the above metal-silicides and the associated electric properties will also be discussed.

OSTI ID:
21208063
Journal Information:
AIP Conference Proceedings, Vol. 475, Issue 1; Conference: 15. international conference on the application of accelerators in research and industry, Denton, TX (United States), 4-7 Nov 1998; Other Information: DOI: 10.1063/1.59293; (c) 1999 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
Country of Publication:
United States
Language:
English