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Title: Joining of superalloy Inconel 600 by diffusion induced isothermal solidification of a liquated insert metal

Abstract

The effect of process variables on the microstructure of transient liquid phase bonded IN 600 using a commercial filler alloy was studied. Microstructural examination of bonded specimens showed that isothermal solidification of the liquated insert occurred during holding at the joining temperatures. In cases where the holding time was insufficient for complete isothermal solidification, the residual liquid transformed on cooling into a centerline eutectic product. The width of the eutectic decreased with increased holding time and an increase in initial gap width resulted in thicker eutectic width in specimens bonded at the same temperature and for equivalent holding times. In addition to the centerline eutectic microconstituent, precipitation of boron-rich particles was observed within the base metal region adjacent to the substrate-joint interface. Formation of these particles appeared to have influenced the rate of solidification of the liquated interlayer during bonding. In contrast to the conventional expectation of an increase in the rate of isothermal solidification with an increase in temperature, a decrease in the rate was observed with an increase in temperatures above 1160 deg. C. This could be related to a decrease in solubility of boron in nickel above the Ni-B eutectic temperature.

Authors:
;  [1]
  1. Department of Mechanical and Manufacturing Engineering, University of Manitoba, Winnipeg, Manitoba, R3T 5V6 (Canada)
Publication Date:
OSTI Identifier:
21140754
Resource Type:
Journal Article
Journal Name:
Materials Characterization
Additional Journal Information:
Journal Volume: 59; Journal Issue: 8; Other Information: DOI: 10.1016/j.matchar.2007.08.023; PII: S1044-5803(07)00313-0; Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 1044-5803
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BONDING; BORON ALLOYS; BRAZING; EUTECTICS; INCONEL 600; INTERFACES; LIQUIDS; MICROSTRUCTURE; PARTICLES; SOLIDIFICATION; SOLUBILITY

Citation Formats

Egbewande, A T, Chukwukaeme, C, and Ojo, O.A. Joining of superalloy Inconel 600 by diffusion induced isothermal solidification of a liquated insert metal. United States: N. p., 2008. Web. doi:10.1016/j.matchar.2007.08.023.
Egbewande, A T, Chukwukaeme, C, & Ojo, O.A. Joining of superalloy Inconel 600 by diffusion induced isothermal solidification of a liquated insert metal. United States. https://doi.org/10.1016/j.matchar.2007.08.023
Egbewande, A T, Chukwukaeme, C, and Ojo, O.A. 2008. "Joining of superalloy Inconel 600 by diffusion induced isothermal solidification of a liquated insert metal". United States. https://doi.org/10.1016/j.matchar.2007.08.023.
@article{osti_21140754,
title = {Joining of superalloy Inconel 600 by diffusion induced isothermal solidification of a liquated insert metal},
author = {Egbewande, A T and Chukwukaeme, C and Ojo, O.A.},
abstractNote = {The effect of process variables on the microstructure of transient liquid phase bonded IN 600 using a commercial filler alloy was studied. Microstructural examination of bonded specimens showed that isothermal solidification of the liquated insert occurred during holding at the joining temperatures. In cases where the holding time was insufficient for complete isothermal solidification, the residual liquid transformed on cooling into a centerline eutectic product. The width of the eutectic decreased with increased holding time and an increase in initial gap width resulted in thicker eutectic width in specimens bonded at the same temperature and for equivalent holding times. In addition to the centerline eutectic microconstituent, precipitation of boron-rich particles was observed within the base metal region adjacent to the substrate-joint interface. Formation of these particles appeared to have influenced the rate of solidification of the liquated interlayer during bonding. In contrast to the conventional expectation of an increase in the rate of isothermal solidification with an increase in temperature, a decrease in the rate was observed with an increase in temperatures above 1160 deg. C. This could be related to a decrease in solubility of boron in nickel above the Ni-B eutectic temperature.},
doi = {10.1016/j.matchar.2007.08.023},
url = {https://www.osti.gov/biblio/21140754}, journal = {Materials Characterization},
issn = {1044-5803},
number = 8,
volume = 59,
place = {United States},
year = {Fri Aug 15 00:00:00 EDT 2008},
month = {Fri Aug 15 00:00:00 EDT 2008}
}