Phase control of iridium and iridium oxide thin films in atomic layer deposition
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701 (Korea, Republic of)
The atomic layer deposition of iridium (Ir) and iridium oxide (IrO{sub 2}) films was investigated using an alternating supply of (ethylcyclopentadienyl)(1,5-cyclooctadiene) iridium and oxygen gas at temperatures between 230 and 290 deg. C. The phase transition between Ir and IrO{sub 2} occurred at the critical oxygen partial pressure during the oxygen injection pulse. The oxygen partial pressure was controlled by the O{sub 2}/(Ar+O{sub 2}) ratio or deposition pressures. The resistivity of the deposited Ir and IrO{sub 2} films was about 9 and 120 {mu}{omega} cm, respectively. In addition, the critical oxygen partial pressure for the phase transition between Ir and IrO{sub 2} was increased with increasing the deposition temperature. Thus, the phase of the deposited film, either Ir or IrO{sub 2}, was controlled by the oxygen partial pressure and the deposition temperature. However, the formation of a thin Ir layer was detected between the IrO{sub 2} and SiO{sub 2} substrate. To remove this interfacial layer, the oxygen partial pressure is increased to a severe condition. And the impurity contents were below the detection limit of Auger electron spectroscopy in both Ir and IrO{sub 2} films.
- OSTI ID:
- 21064516
- Journal Information:
- Journal of Applied Physics, Vol. 103, Issue 2; Other Information: DOI: 10.1063/1.2836965; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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