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Title: A more elemental examination of factors governing PV module environmental stability

Abstract

To date, photovoltaic module reliability studies have primarily focused on retention of initial power when exposed to various environmental stresses. While power of a PV module is one reliability measure, the fundamental parameters affecting photovoltaic module stability are typically not measured for baseline analysis. This study examines these questions in context of fundamental parameters, in an attempt to gain insight at a more elemental level than possible using power measurements. One of the fundamental parameters in PV module reliability is the adhesion of the encapsulant EVA to various module surfaces. The analysis of surface adhesion, both in its initial state, and as it changes with various exposures is studied here, primarily focusing on adhesion of EVA to glass, cell surfaces and the interconnect ribbon. Of particular interest is the affect of manufacturing processes and surface cleanliness on this bond strength. Measurements of EVA adhesion and how it is affected by surface contamination due to residual solder flux have also been specifically quantified. The summary analysis looked at EVA bonds as a function of environmental exposures. The results of this analysis shows that initial strength of EVA bonds are quite high, these are diminished by both surface contamination effects and environmentalmore » exposures. The ultimate bond strength and the ratio to the initial value are variable dependent upon the exposure.« less

Authors:
; ; ;  [1]; ;  [2]
  1. Siemens Solar Industries, Camarillo, CA (United States)
  2. Springborn Labs., Inc., Enfield, CT (United States)
Publication Date:
OSTI Identifier:
208209
Report Number(s):
CONF-941203-
ISBN 0-7803-1459-X; TRN: IM9616%%537
Resource Type:
Conference
Resource Relation:
Conference: 1. world conference on photovoltaic energy conversion, Waikoloa, HI (United States), 5-9 Dec 1994; Other Information: PBD: 1994; Related Information: Is Part Of 1994 IEEE first world conference on photovoltaic energy conversion: Conference record of the twenty fourth IEEE photovoltaic specialists conference -- 1994. Volume 1; PB: 1303 p.
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; SILICON SOLAR CELLS; ADHESIVES; RELIABILITY; PERFORMANCE; ADHESION; METALLURGICAL FLUX; REMOVAL; MECHANICAL TESTS; CHLOROFLUOROCARBONS; MATERIAL SUBSTITUTION; SURFACE CLEANING; MOISTURE; FREEZING; HEAT TREATMENTS

Citation Formats

Jester, T L, Aldrich, D, Hummel, J, Wieting, R D, Galica, J P, and Thoma, L. A more elemental examination of factors governing PV module environmental stability. United States: N. p., 1994. Web.
Jester, T L, Aldrich, D, Hummel, J, Wieting, R D, Galica, J P, & Thoma, L. A more elemental examination of factors governing PV module environmental stability. United States.
Jester, T L, Aldrich, D, Hummel, J, Wieting, R D, Galica, J P, and Thoma, L. 1994. "A more elemental examination of factors governing PV module environmental stability". United States.
@article{osti_208209,
title = {A more elemental examination of factors governing PV module environmental stability},
author = {Jester, T L and Aldrich, D and Hummel, J and Wieting, R D and Galica, J P and Thoma, L},
abstractNote = {To date, photovoltaic module reliability studies have primarily focused on retention of initial power when exposed to various environmental stresses. While power of a PV module is one reliability measure, the fundamental parameters affecting photovoltaic module stability are typically not measured for baseline analysis. This study examines these questions in context of fundamental parameters, in an attempt to gain insight at a more elemental level than possible using power measurements. One of the fundamental parameters in PV module reliability is the adhesion of the encapsulant EVA to various module surfaces. The analysis of surface adhesion, both in its initial state, and as it changes with various exposures is studied here, primarily focusing on adhesion of EVA to glass, cell surfaces and the interconnect ribbon. Of particular interest is the affect of manufacturing processes and surface cleanliness on this bond strength. Measurements of EVA adhesion and how it is affected by surface contamination due to residual solder flux have also been specifically quantified. The summary analysis looked at EVA bonds as a function of environmental exposures. The results of this analysis shows that initial strength of EVA bonds are quite high, these are diminished by both surface contamination effects and environmental exposures. The ultimate bond strength and the ratio to the initial value are variable dependent upon the exposure.},
doi = {},
url = {https://www.osti.gov/biblio/208209}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Dec 31 00:00:00 EST 1994},
month = {Sat Dec 31 00:00:00 EST 1994}
}

Conference:
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