Plasma damage-free deposition of Al cathode on organic light-emitting devices by using mirror shape target sputtering

Journal Article · Mon Nov 08 00:00:00 EST 2004 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.1815394· OSTI ID:20634396

Kim, Han-Ki; Kim, D -G; Lee, K -S; Huh, M -S; Jeong, S H; Kim, K I; Kim, H; Han, D W; Kwon, J H ^[1]

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1. Core Technology Laboratory, Samsung SDI, Co., LTD, 575 Shin-dong, Youngtong-Gu, Suwon, Gyeonggi-Do, 442-391 (Korea, Republic of)

We report on the fabrication of plasma damage-free organic light-emitting devices (OLEDs) by using a mirror shape target sputtering (MSTS) technique. It is shown that OLEDs with Al cathode deposited by the MSTS show much lower leakage current (1x10{sup -5} mA/cm{sup 2}) at reverse bias of -6 V, compared to that (1x10{sup -1}-{approx}10{sup -2} mA/cm{sup 2} at -6 V) of OLEDs with Al cathodes grown by conventional dc magnetron sputtering. This indicates that there is no plasma damage, which is caused by the bombardment of energetic particles. This suggests that MSTS could be a useful plasma damage-free and low-temperature deposition technique for both top- and bottom-emitting OLEDs and flexible displays.

• OSTI ID: 20634396
• Journal Information: Applied Physics Letters, Vol. 85, Issue 19; Other Information: DOI: 10.1063/1.1815394; (c) 2004 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALUMINIUM
CATHODES
CURRENT DENSITY
DEPOSITION
FABRICATION
LEAKAGE CURRENT
LIGHT EMITTING DIODES
MAGNETRONS
MIRRORS
PLASMA
SPUTTERING
THIN FILMS