Sol-gel synthesis of a diepoxy-crosslinked ormocer adhesive for Cu/polyimide sealing systems

Conference · Sun Dec 31 00:00:00 EST 1995

OSTI ID:175528

Kasemann, R; Burkhart, T; Schmidt, H ^[1]

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1. Institut fuer Materialien gem, Saarbruecken (Germany)

Sol-gel-derived Omocer adhesives starting from methyl-vinyl silanes, diphenyl silanes and tetraethoxy silanes with tailored strain dissipation properties have been synthesized and tailored as hot-melt sealing adhesives for Cu to polyimide. In order to establish an appropriate strain dissipation mechanism within the brittle Ormocer systems used as starting materials, an organic polymer chain based crosslinking reaction, linking amino groupings bonded to silanes together with difunctional epoxides was investigated. For controlling the process, spectroscopic data were used and correlated to peel strength. The system shows a peel strength of 10 N/cm, good dielectric properties and a high heat stability.

• OSTI ID: 175528
• Report Number(s): CONF-9410372-; TRN: 95:006888-0027
• Resource Relation: Conference: 1. international symposium on sol-gel science and technology, Los Angeles, CA (United States), 19-22 Oct 1994; Other Information: PBD: 1995; Related Information: Is Part Of Ceramic transactions: Sol-gel science and technology. Volume 55; Pope, E.J.A.; Sakka, Sumio; Klein, L.C. [eds.]; PB: 411 p.
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SILANES
DIELECTRIC PROPERTIES
SYNTHESIS
ADHESIVES
EPOXIDES
STABILITY
SOL-GEL PROCESS
COPPER
IMIDES
ORGANIC POLYMERS
SEALING MATERIALS