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Title: Aluminum nitrides. (Latest citations from the US Patent bibliographic file with exemplary claims). Published Search

The bibliography contains citations of selected patents concerning aluminum nitride (AlN) materials and products. The manufacture of AlN powders, films, layers, flakes, coatings, and substrates is described. Sintered bodies with high thermal conductivity, low permittivity, high mechanical strength, and excellent durability are included. Applications cover highly integrated circuits, circuit boards, electronic packaging, ceramics, and heat conduction. (Contains 50-250 citations and includes a subject term index and title list.) (Copyright NERAC, Inc. 1995)
Publication Date:
OSTI Identifier:
167006
Report Number(s):
PB--96-853700/XAB
TRN: 53523502
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Nov 1995
Research Org:
NERAC, Inc., Tolland, CT (United States)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ALUMINIUM NITRIDES; THERMAL CONDUCTIVITY; PERMITTIVITY; FRACTURE PROPERTIES; PATENTS; POWDERS; FILMS; LAYERS; COATINGS; SUBSTRATES; BIBLIOGRAPHIES; USES