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Title: Ohmic contacts to Al-rich AlGaN heterostructures

Journal Article · · Physica Status Solidi. A, Applications and Materials Science

Due to the ultra-wide bandgap of Al-rich AlGaN, up to 5.8 eV for the structures in this study, obtaining low resistance ohmic contacts is inherently difficult to achieve. A comparative study of three different fabrication schemes is presented for obtaining ohmic contacts to an Al-rich AlGaN channel. Schottky-like behavior was observed for several different planar metallization stacks (and anneal temperatures), in addition to a dry-etch recess metallization contact scheme on Al0.85Ga0.15N/Al0.66Ga0.34N. However, a dry etch recess followed by n+-GaN regrowth fabrication process is reported as a means to obtain lower contact resistivity ohmic contacts on a Al0.85Ga0.15N/Al0.66Ga0.34N heterostructure. In conclusion, specific contact resistivity of 5×10-3 Ω cm2 was achieved after annealing Ti/Al/Ni/Au metallization.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA); USDOE Laboratory Directed Research and Development (LDRD) Program
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1398780
Alternate ID(s):
OSTI ID: 1374948
Report Number(s):
SAND-2017-9872J; 656978
Journal Information:
Physica Status Solidi. A, Applications and Materials Science, Vol. 214, Issue 8; ISSN 1862-6300
Publisher:
WileyCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 37 works
Citation information provided by
Web of Science

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Cited By (3)

Planar Ohmic Contacts to Al 0.45 Ga 0.55 N/Al 0.3 Ga 0.7 N High Electron Mobility Transistors journal January 2017
Multidimensional thermal analysis of an ultrawide bandgap AlGaN channel high electron mobility transistor journal October 2019
Design of compositionally graded contact layers for MOCVD grown high Al-content AlGaN transistors journal July 2019

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