Ohmic contacts to Al-rich AlGaN heterostructures
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Due to the ultra-wide bandgap of Al-rich AlGaN, up to 5.8 eV for the structures in this study, obtaining low resistance ohmic contacts is inherently difficult to achieve. A comparative study of three different fabrication schemes is presented for obtaining ohmic contacts to an Al-rich AlGaN channel. Schottky-like behavior was observed for several different planar metallization stacks (and anneal temperatures), in addition to a dry-etch recess metallization contact scheme on Al0.85Ga0.15N/Al0.66Ga0.34N. However, a dry etch recess followed by n+-GaN regrowth fabrication process is reported as a means to obtain lower contact resistivity ohmic contacts on a Al0.85Ga0.15N/Al0.66Ga0.34N heterostructure. In conclusion, specific contact resistivity of 5×10-3 Ω cm2 was achieved after annealing Ti/Al/Ni/Au metallization.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA); USDOE Laboratory Directed Research and Development (LDRD) Program
- Grant/Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1398780
- Alternate ID(s):
- OSTI ID: 1374948
- Report Number(s):
- SAND-2017-9872J; 656978
- Journal Information:
- Physica Status Solidi. A, Applications and Materials Science, Vol. 214, Issue 8; ISSN 1862-6300
- Publisher:
- WileyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
Web of Science
Planar Ohmic Contacts to Al 0.45 Ga 0.55 N/Al 0.3 Ga 0.7 N High Electron Mobility Transistors
|
journal | January 2017 |
Multidimensional thermal analysis of an ultrawide bandgap AlGaN channel high electron mobility transistor
|
journal | October 2019 |
Design of compositionally graded contact layers for MOCVD grown high Al-content AlGaN transistors
|
journal | July 2019 |
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