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Title: Probe tip heating assembly

Patent ·
OSTI ID:1330349
;

A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.

Research Organization:
Hysitron, Inc., Eden Prairie, MN (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FG02-07ER84812
Assignee:
Hysitron, Inc. (Eden Prairie, MN)
Patent Number(s):
9,476,816
Application Number:
14/358,065
OSTI ID:
1330349
Resource Relation:
Patent File Date: 2012 Nov 14
Country of Publication:
United States
Language:
English

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