Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0

Cheng, Tao; Xiao, Hai; Goddard, III, William A.

doi:10.1021/acs.jpclett.5b02247

Title: Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0

Journal Article · Tue Nov 17 00:00:00 EST 2015 · Journal of Physical Chemistry Letters

DOI:https://doi.org/10.1021/acs.jpclett.5b02247· OSTI ID:1328816

Cheng, Tao ^[1]; Xiao, Hai ^[1]; Goddard, III, William A. ^[1]

Materials and Process Simulation Center, California Institute of Technology, Pasadena, California 91125, United States

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Sponsoring Organization:: USDOE

Grant/Contract Number:: SC0004993

OSTI ID:: 1328816

Journal Information:: Journal of Physical Chemistry Letters, Journal Name: Journal of Physical Chemistry Letters Vol. 6 Journal Issue: 23; ISSN 1948-7185

Publisher:: American Chemical SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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References (52)

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