Modulus of Elasticity and Thermal Expansion Coefficient of ITO Film
The purpose of this experiment was to determine the modulus of elasticity (E) and thermal expansion coefficient (α) of RF sputtered Indium Tin Oxide (ITO) as a function of temperature (T), and to collect ITO film stress data. In order to accomplish that goal, the Toho FLX-2320-S thin film stress measurement machine was used to collect both single stress and stress-temperature data for ITO coated fused silica and sapphire substrates. The stress measurement function of the FLX-2320-S cannot be used to calculate the elastic modulus of the film because the Stoney formula incorporates the elastic modulus of the substrate, rather than of the film itself.
- Publication Date:
- OSTI Identifier:
- Report Number(s):
- DOE Contract Number:
- Resource Type:
- Technical Report
- Research Org:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org:
- Country of Publication:
- United States
- 36 MATERIALS SCIENCE; 42 ENGINEERING
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