skip to main content

This content will become publicly available on September 18, 2015

Title: Power Cycle Testing of Power Switches: A Literature Survey

Reliability of power converters and lifetime prediction has been a major topic of research in the last few decades, especially for traction applications. The main failures in high power semiconductors are caused by thermomechanical fatigue. Power cycling and temperature cycling are the two most common thermal acceleration tests used in assessing reliability. The objective of this paper is to study the various power cycling tests found in the literature and to develop generalized steps in planning application specific power cycling tests. A comparison of different tests based on the failures, duration, test circuits, and monitored electrical parameters is presented.
Authors:
 [1] ;  [2] ;  [3]
  1. Univ. of Tennessee, Knoxville, TN (United States). Dept. of Electrical Engineering and Computer Science
  2. Univ. of Tennessee, Knoxville, TN (United States). Dept. of Electrical Engineering and Computer Scienc; Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  3. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Group
Publication Date:
OSTI Identifier:
1325461
Grant/Contract Number:
AC05-00OR22725; EEC-1041877
Type:
Accepted Manuscript
Journal Name:
IEEE Transactions on Power Electronics
Additional Journal Information:
Journal Volume: 30; Journal Issue: 5; Journal ID: ISSN 0885-8993
Publisher:
IEEE
Research Org:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Oak Ridge National Environmental Research Park
Sponsoring Org:
USDOE; National Science Foundation (NSF)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; Failure mechanisms; lifetime estimation; physics of failure; power cycling; precursor indicators; semiconductor reliability; IGBT MODULES; HEALTH MANAGEMENT; RELIABILITY; TRACTION; LIFETIME; TECHNOLOGIES; FAILURE; PHYSICS; SYSTEM