This content will become publicly available on June 26, 2014
Why are some Interfaces in Materials Stronger than others?
Grain boundaries (GBs) are often the preferred sites for void nucleation in ductile metals. However, it has been observed that all boundaries do not contribute equally to this process. We present a mechanistic rationale for the role of GBs in damage nucleation in copper, along with a quantitative map for predicting preferred void nucleation at GBs based on molecular dynamics simulations in copper. Simulations show a direct correlation between the void nucleation stress and the ability of a grain boundary to plastically deform by emitting dislocations, during shock compression. Plastic response of a GB, affects the development of stress concentrations believed to be responsible for void nucleation by acting as a dissipation mechanism for the applied stress.
- Publication Date:
- OSTI Identifier:
- Report Number(s):
Journal ID: ISSN 2045-2322
- Grant/Contract Number:
- Accepted Manuscript
- Journal Name:
- Scientific Reports
- Additional Journal Information:
- Journal Volume: 4; Journal ID: ISSN 2045-2322
- Nature Publishing Group
- Research Org:
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Sponsoring Org:
- Country of Publication:
- United States
- 36 MATERIALS SCIENCE; Grain boundary, void nucleation, shock loading
Enter terms in the toolbar above to search the full text of this document for pages containing specific keywords.