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Title: SENSITIVITY OF COPPER DISSOLUTION TO THE FLOW BEHAVIOR OF MOLTEN SN-PB SOLDER.

Abstract not provided.
Authors:
; ; ;
Publication Date:
OSTI Identifier:
1315661
Report Number(s):
SAND2014-15672C
533637
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the Surface Mount Technology Association International Conference held September 28 - October 2, 2014 in Rosemont, IL.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Nonproliferation (NA-20)
Country of Publication:
United States
Language:
English