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Title: Numerical Simulation of Ni Grain Growth in a Thermal Gradient.

Abstract not provided.
Authors:
;
Publication Date:
OSTI Identifier:
1315397
Report Number(s):
SAND2014-20514C
551817
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the SIAM Conference on Computational Science and Engineering held March 14-18, 2015 in Salt Lake City, Utah.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
Kitware
Country of Publication:
United States
Language:
English