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Title: Hardness Assurance in Advanced Semiconductor Packaging with 85Kr Leak Testing.

Abstract not provided.
Authors:
; ; ;
Publication Date:
OSTI Identifier:
1315152
Report Number(s):
SAND2014-4122C
518298
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the Nuclear and Space Radiation Effects Conference held July 14-18, 2014 in Paris, France.
Research Org:
Sandia National Laboratories (SNL-CA), Livermore, CA (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English