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Title: Characterization of the Mechanical Stress Impact on Device Electrical Performance in the CMOS and III-V HEMT/HBT Heterogeneous Integration Environment.

Abstract not provided.
Authors:
; ; ; ;
Publication Date:
OSTI Identifier:
1304916
Report Number(s):
SAND2015-6936C
599032
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the IEEE 2015 International 3D Systems Integration Conference (3DIC 2015) held August 31-2, 2015 in Sendai, Japan.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English