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Title: Maintaining Low Voiding SolderDie Attach for Power Die While Minimizing Die Tilt.

Abstract not provided.
Authors:
;
Publication Date:
OSTI Identifier:
1289565
Report Number(s):
SAND2015-6526C
598710
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the IMAPS 2015 - Orlando held October 26-29, 2015 in Orlando, FL.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English